
Physical Dimensions (Continued)
2X
0.10 C
2.10
A
B
1.62
KEEPOUT ZONE, NO TRACES
(0.11)
OR VIAS ALLOWED
PIN1 IDENT IS
2X LONGER THAN
1.60
0.10 C
1.12
0.56
(0.35) 10X
OTHER LINES
TOP VIEW
2X
0.50
(0.25) 10X
RECOMMENDED LAND PATTERN
0.55 MAX
0.05 C
0.05 C
C
SIDE VIEW
0.05
0.00
(0.20)
0.35
0.25
DETAIL A
0.35
0.25
D
0.65
0.55
1
4
(0.36)
0.56
(0.15)
0.35
0.25
DETAIL A 2X SCALE
10
5
NOTES:
A. PACKAGE CONFORMS TO JEDEC
0.25 9X
0.35 9X
(0.29)
0.50
9
1.62
6
0.15
0.25
0.10
C A B
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. PRESENCE OF CENTER PAD IS PACKAGE
SUPPLIER DEPENDENT. IF PRESENT IT
0.05
C
IS NOT INTENDED TO BE SOLDERED AND
BOTTOM VIEW
ALL FEATURES
HAS A BLACK OXIDE FINISH.
E. DRAWING FILENAME: MKT-MAC10Arev5.
Figure 20. 10-Lead MicroPak? MLP
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notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2010 Fairchild Semiconductor Corporation
FAN5622 / FAN5624 / FAN5626 ? Rev. 1.0.3
12
www.fairchildsemi.com